We're excited to introduce a high-performance 3-layer PCB constructed with advanced F4BM265 material. This PCB is specifically engineered to meet the rigorous demands of various high-frequency applications, ensuring exceptional reliability and performance.

PCB Construction

This PCB is characterized by the following key construction features:

- Material: F4BM265
- Layers: Comprises 3 layers
- Dimensions: Measures 168mm x 168mm, with a tolerance of ±0.15mm
- Trace and Space: Minimum of 6/8 mils
- Hole Size: Minimum diameter of 0.4mm
- Blind Vias: No
- Thickness: Finished board thickness of 6.2mm
- Copper Weight: 1 oz (1.4 mils) for both inner and outer layers
- Via Plating: Thickness of 20 μm
- Surface Finish: Bare copper
- Silkscreen: No
- Solder Mask: No
- Testing: Undergoes 100% electrical testing prior to shipment

These specifications are engineered to deliver exceptional performance and reliability across various applications.

PCB Stackup Configuration
This PCB features a robust stackup that includes a 2-layer rigid design. The configuration consists of:

Copper_layer_1 - 35 μm
F4BM265 Core - 3.0 mm (118mil)
Copper_layer_2 - 35 μm
Bonding Ply-
F4BM265 Core - 3.0 mm (118mil)
Copper_layer_3 - 35 μm

This structure is engineered to provide excellent electrical performance and thermal management, essential for high-frequency applications.

Artwork and Quality Standards
The artwork supplied for this PCB follows the Gerber RS-274-X format, allowing for precise manufacturing and assembly. Adhering to IPC-Class-2 quality standards, each board is produced to meet rigorous industry requirements, ensuring reliability for various applications.

Introduction to F4BM265
The F4BM series laminates are formulated by scientifically combining fiberglass cloth, polytetrafluoroethylene resin, and PTFE film. Compared to the previous F4B material, F4BM265 delivers improved electrical performance, characterized by a wider range of dielectric constants, reduced dielectric loss, increased insulation resistance, and enhanced stability. This material can effectively replace similar foreign products.

The F4BM and F4BME variants share the same dielectric layer but differ in copper foil combinations. F4BM is designed with electrodynamic (ED) copper foil, making it suitable for applications that do not require passive intermodulation (PIM) performance. In contrast, F4BME utilizes reverse-treated foil (RTF), providing superior PIM characteristics, more precise line control, and lower conductor loss.

Features of F4BM265
The F4BM265 material offers several key features that enhance its usability:

Dielectric Constant (Dk): 2.65 ±0.05 at 10 GHz

Dissipation Factor: 0.0013 at 10 GHz, 0.0018 at 20 GHz

Temperature Coefficient of Dielectric Constant (TCDK): -100 ppm/°C (temperature range: -55°C to 150°C)

CTE (Coefficient of Thermal Expansion):
X-axis: 14 ppm/°C
Y-axis: 17 ppm/°C
Z-axis: 142 ppm/°C (temperature range: -55°C to 288°C)

Thermal Conductivity: 0.36 W/mk

Moisture Absorption: 0.08%

These features make the F4BM265 material particularly suitable for high-frequency applications, ensuring low loss and enhanced dimensional stability.

Typical Applications
This PCB is well-suited for a variety of applications, including:

Microwave, RF, and Radar Systems: Ideal for high-frequency communication devices.

Phase Shifters and Passive Components: Essential for efficient signal processing.

Power Dividers, Couplers, and Combiners: Critical for effective signal distribution.

Feed Networks and Phased Array Antennas: Vital for advanced radar and satellite communications.

Satellite Communications: Supports a range of communication technologies.

Base Station Antennas: Integral to mobile and wireless communication infrastructure.

Conclusion
With its durable construction, superior electrical performance, and versatility, this PCB is poised to meet the evolving demands of industries reliant on high-frequency circuit boards.

For more details or to place an order, please reach out to our sales team. We look forward to collaborating with you.

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners