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3-Layer RO4003C PCB 1.8mm Thick with Blind Vias

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    Buy cheap 3-Layer RO4003C PCB 1.8mm Thick with Blind Vias from wholesalers
     
    Buy cheap 3-Layer RO4003C PCB 1.8mm Thick with Blind Vias from wholesalers
    • Buy cheap 3-Layer RO4003C PCB 1.8mm Thick with Blind Vias from wholesalers

    3-Layer RO4003C PCB 1.8mm Thick with Blind Vias

    Ask Lasest Price
    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
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    3-Layer RO4003C PCB 1.8mm Thick with Blind Vias

    This PCB is a high-performance 3-layer printed circuit board made from advanced materials, specifically RO4003C and RO4450F. It is designed for precision and reliability, meeting stringent specifications to ensure optimal electrical performance and mechanical stability.


    PCB details

    ParameterSpecification
    Base MaterialRO4003C / RO4450F
    Layer Count3 Layers
    Board Dimensions291mm x 155mm ± 0.15mm (2 Types, 2 PCS)
    Minimum Trace/Space5/4 mils
    Minimum Hole Size0.3mm
    Blind ViasTop Layer to Inner Layer 1
    Finished Board Thickness1.82mm
    Finished Cu Weight1oz (1.4 mils) outer layers / 1oz inner layers
    Via Plating Thickness20 μm
    Surface FinishImmersion Gold
    Top SilkscreenWhite
    Bottom SilkscreenNo
    Top Solder MaskBlack
    Bottom Solder MaskNo
    Electrical Testing100% electrical test used prior to shipment

    The stack-up of this 3-layer rigid PCB is structured as follows:


    - Copper Layer 1: 35 μm

    -Rogers 4003C Core: 0.813 mm (32 mil)

    - Copper Layer 2: 35 μm

    - Bonding Ply: RO4450F - 0.102 mm (4 mil)

    - Rogers 4003C Core: 0.813 mm (32 mil)

    - Copper Layer 3: 35 μm


    3-Layer RO4003C PCB 1.8mm Thick with Blind Vias


    Artwork and Quality Standards

    The artwork supplied is in the Gerber RS-274-X format, adhering to IPC-Class-2 quality standards. This ensures that the PCB meets industry requirements for reliability and performance.


    Global Availability

    This high-performance PCB is available worldwide, making it accessible for various applications across different markets.


    Introduction to RO4003C

    Rogers RO4003C is a proprietary material known for its excellent electrical performance. It combines the benefits of PTFE/woven glass with the manufacturability of epoxy/glass, offering a cost-effective solution for microwave laminates. Key features include:


    - Dielectric Constant (Dk): 3.38 ±0.05 at 10GHz

    - Dissipation Factor: 0.0027 at 10GHz and 0.0021 at 2.5GHz

    - Thermal Coefficient of Dielectric Constant: +40 ppm/°C

    - Thermal Conductivity: 0.71 W/m/°K

    - Low Moisture Absorption: 0.06%


    The material's thermal expansion characteristics align closely with copper, facilitating reliable plated through-hole quality.


    Benefits

    Rogers RO4003C offers numerous benefits, including:

    - Ideal for multi-layer board constructions

    - Lower fabrication costs compared to standard materials like FR-4

    - Designed for performance-sensitive, high-volume applications

    - Competitively priced, making it a popular choice


    Typical Applications

    RO4003C PCB is suitable for various applications, including:


    - Cellular base station antennas and power amplifiers

    - RF identification tags

    - Automotive radar and sensors

    - LNBs for direct broadcast satellites


    Conclusion

    The 3-layer PCB constructed with RO4003C and RO4450F materials exemplifies advanced engineering and design, making it ideal for demanding applications in telecommunications, automotive, and aerospace industries. Its combination of high performance, cost-effectiveness, and reliability ensures it meets the needs of modern electronics.


    3-Layer RO4003C PCB 1.8mm Thick with Blind Vias

    Quality 3-Layer RO4003C PCB 1.8mm Thick with Blind Vias for sale
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