This high-performance 2-layer rigid PCB is crafted from TSM-DS3, a ceramic-filled reinforced material boasting an ultra-low fiberglass content of approximately 5%. Tailored for high-power, high-frequency, and thermally challenging applications, it capitalizes on TSM-DS3’s remarkable thermal conductivity, low dielectric loss, and dimensional stability.

PCB Specifications

PCB Stack-up Configuration

The 2-layer stack-up is engineered to maximize TSM-DS3’s thermal and electrical performance, with a simplified structure tailored to high-power, high-frequency needs:

TSM-DS3 Material Overview

TSM-DS3 is a ceramic-filled reinforced material designed to bridge the gap between high-performance low-loss laminates and epoxy-based materials, with key distinguishing traits:

Composition: Ceramic fillers with ultra-low fiberglass content (~5%), enabling both low dielectric loss and dimensional stability that rivals epoxies.

Core Strengths: Thermally stable (TC=0.65 W/m·K) for high-power heat management, and low thermal expansion (matched to copper CTE) for demanding thermal cycling—critical for applications like oil drilling and semiconductor ATE testing.

Manufacturability: Compatible with standard PCB fabrication processes, supporting large-format, high-layer-count designs with the consistency and yield of fiberglass-reinforced epoxies, despite its low fiberglass content.

TSM-DS3 Key Features

TSM-DS3 delivers targeted performance features that define the PCB’s suitability for high-power, high-frequency applications:

• Precise Dielectric Constant: Dk=3.0±0.05 at 10GHz/23°C, ensuring minimal impedance variation across the board—essential for phased array antennas and couplers that require tight phase matching.

• Ultra-Low Dissipation Factor: 0.0014 at 10GHz, minimizing signal attenuation in high-frequency paths, preserving power efficiency in radar manifolds and mmWave antennas.

• High Thermal Conductivity: 0.65 W/MK (unclad), enabling efficient heat dissipation from high-power components (e.g., RF amplifiers) to prevent overheating and performance degradation.

• Low Moisture Absorption: 0.07%, preventing dielectric degradation and Dk drift in humid or harsh environments (e.g., oil drilling equipment, outdoor radar systems).

• Copper-Matched CTE: X-axis=10 ppm/°C, Y-axis=16 ppm/°C, Z-axis=23 ppm/°C, reducing thermal stress between copper layers and the substrate during thermal cycling—critical for long-term reliability in automotive and aerospace applications.

TSM-DS3 Material Benefits

The features of TSM-DS3 translate to tangible advantages for PCB design, manufacturing, and application performance:

• Low Fiberglass Content (~5%): Reduces dielectric discontinuities compared to traditional fiberglass-reinforced materials, improving high-frequency signal integrity.

• Epoxy-Rivaling Dimensional Stability: Enables large-format PCB fabrication (e.g., 68mm×126mm size of this PCB) without warpage, supporting complex component layouts.

• Large-Format, High-Layer-Count Compatibility: Facilitates scaling to multi-layer designs while maintaining yield and consistency—ideal for future iterations of high-power systems.

• Stable Dk Across Temperature: ±0.25% Dk variation from -30°C to 120°C, ensuring consistent performance in extreme operating environments (e.g., automotive mmWave radar, oil drilling electronics).

• Resistive Foil Compatibility: Supports integration of resistive foils for embedded passive components, simplifying design and reducing component count in compact systems.

Artwork Format: Gerber RS-274-X, the industry-standard format for PCB fabrication, ensuring compatibility with global manufacturing equipment.

Accepted Standard: IPC-Class-2 compliance, guaranteeing reliable performance for commercial and industrial high-power/high-frequency applications with strict controls for trace accuracy, hole precision, and electrical continuity.

Processing Compatibility: TSM-DS3’s manufacturability (consistent with epoxy processes) eliminates the need for specialized equipment, reducing production costs and lead times.

Typical Applications:

- Couplers

- Phased Array Antennas

- Radar Manifolds

- mmWave Antenna/Automotive

- Oil Drilling

- Semiconductor/ATE Testing

Availability

This PCB is available for worldwide shipping, supporting global project requirements.

Conclusion

This 2-layer TSM-DS3 PCB combines the material’s unique ceramic-filled, low-fiberglass composition (low loss, high thermal conductivity) with precision manufacturing to address the demands of high-power, high-frequency applications.

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners