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15mil Rogers TMM6 PCB 2-Layer with 0.5mm Thickness and 40mm × 70mm Dimensions

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    Buy cheap 15mil Rogers TMM6 PCB 2-Layer with 0.5mm Thickness and 40mm × 70mm Dimensions from wholesalers
     
    Buy cheap 15mil Rogers TMM6 PCB 2-Layer with 0.5mm Thickness and 40mm × 70mm Dimensions from wholesalers
    • Buy cheap 15mil Rogers TMM6 PCB 2-Layer with 0.5mm Thickness and 40mm × 70mm Dimensions from wholesalers

    15mil Rogers TMM6 PCB 2-Layer with 0.5mm Thickness and 40mm × 70mm Dimensions

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    Brand Name : Bicheng
    Model Number : BIC-052.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    15mil Rogers TMM6 PCB 2-Layer with 0.5mm Thickness and 40mm × 70mm Dimensions

    This high-performance 2-layer rigid printed circuit board (PCB) is meticulously engineered using Rogers' TMM6 thermoset microwave material—a ceramic-thermoset polymer composite optimized for stripline and microstrip applications—to meet stringent electrical, thermal, and mechanical standards, making it ideal for a wide range of high-frequency RF, microwave, and communication systems.


    PCB Specification

    ItemSpecification
    Base MaterialTMM6 (Rogers thermoset microwave ceramic-polymer composite)
    Layer Count2 layers
    Board Dimensions40mm × 70mm per unit (1PCS), with a tolerance of ±0.15mm
    Minimum Trace/Space4 mils (trace width) / 5 mils (trace spacing)
    Minimum Hole Size0.2mm
    Blind ViasNo
    Finished Board Thickness0.5mm
    Finished Cu Weight (Outer Layers)1oz (equivalent to 1.4 mils or 35μm)
    Via Plating Thickness20 μm
    Surface FinishImmersion silver
    SilkscreenNo
    Solder MaskNo
    Electrical Test (Prior to Shipment)100% electrical test (covers continuity, insulation resistance, and short-circuit detection)

    Layer Stack-up

    The 2-layer stack-up is precisely designed to maximize the performance advantages of Rogers TMM6 material, with clear layer functions and thicknesses:

    Layer TypeMaterialThickness
    Top Conductive LayerCopper_layer_135μm
    Core Insulation LayerRogers TMM6 Thermoset0.381mm (15mil)
    Bottom Conductive LayerCopper_layer_235μm

    Artwork Format: Gerber RS-274-X, the industry-standard PCB fabrication format, ensuring compatibility and reducing fabrication errors.


    Quality Standard: Complies with IPC-Class 2, meeting the reliability requirements of commercial and industrial high-frequency applications—ensures consistent performance under normal operating conditions and environmental variations.


    Availability: Worldwide shipping.


    Material Attributes of Rogers TMM6

    As a ceramic-thermoset polymer composite tailored for microwave applications, Rogers TMM6 possesses unique properties that form the foundation of the PCB’s high performance:


    15mil Rogers TMM6 PCB 2-Layer with 0.5mm Thickness and 40mm × 70mm Dimensions


    1. Electrical Performance

    Dielectric Constant (Dk): 6.0 ± 0.08 at 10GHz, with tight tolerance to ensure predictable signal propagation—critical for designing precise RF/microwave components such as filters and couplers.

    Dissipation Factor (Df): 0.0023 at 10GHz, ultra-low loss to minimize signal attenuation—maintains signal integrity even in long trace routes, which is essential for high-frequency communication systems.


    Thermal Coefficient of Dk: -11 ppm/°K, minimizing Dk drift caused by temperature changes—ensures stable performance in environments with fluctuating temperatures (such as outdoor communication equipment or satellite systems).


    2. Thermal & Mechanical Resilience

    Decomposition Temperature (Td): 425°C (TGA), withstanding high temperatures generated by power dissipation (e.g., in power amplifiers) and reflow soldering processes—prevents material degradation under extreme heat.


    Coefficient of Thermal Expansion (CTE): 18 ppm/K (x-axis), 18 ppm/K (y-axis), 26 ppm/K (z-axis), matching the CTE of copper—avoids delamination between copper layers and TMM6 core during thermal cycling, enhancing structural stability.


    Thermal Conductivity: 0.72 W/mK, efficiently dissipating heat from high-power components—reduces thermal hotspots and extends the service life of sensitive RF devices.


    Mechanical Strength: Resists creep and cold flow, maintaining dimensional stability under mechanical stress—suitable for rugged applications such as automotive GPS antennas or aerospace communication modules.


    3. Fabrication & Application Advantages

    Process Compatibility: Compatible with all common PCB manufacturing processes (including etching, drilling, and plating), eliminating the need for specialized production techniques—reducing manufacturing costs and lowering technical barriers.


    Chemical Resistance: Resistant to process chemicals (such as etchants and cleaning agents), minimizing material damage during fabrication and reducing reject rates.


    Wire-Bonding Reliability: Based on thermoset resin, enabling stable wire bonding for RF chips—ensures reliable high-frequency signal transfer between chips and the PCB, which is critical for microwave circuit performance.


    Some Typical Applications:

    - RF and microwave circuitry

    - Power amplifiers and combiners

    - Filters and coupler

    - Satellite communication systems

    - Global Positioning Systems Antennas

    - Patch Antennas

    - Dielectric polarizers and lenses

    - Chip testers


    15mil Rogers TMM6 PCB 2-Layer with 0.5mm Thickness and 40mm × 70mm Dimensions

    Quality 15mil Rogers TMM6 PCB 2-Layer with 0.5mm Thickness and 40mm × 70mm Dimensions for sale
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