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2-Layer High Frequency PCB with 25mil Rogers RO3206 Substrate 0.75mm Thickness and 63mm x 45mm Size

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    Buy cheap 2-Layer High Frequency PCB with 25mil Rogers RO3206 Substrate 0.75mm Thickness and 63mm x 45mm Size from wholesalers
     
    Buy cheap 2-Layer High Frequency PCB with 25mil Rogers RO3206 Substrate 0.75mm Thickness and 63mm x 45mm Size from wholesalers
    • Buy cheap 2-Layer High Frequency PCB with 25mil Rogers RO3206 Substrate 0.75mm Thickness and 63mm x 45mm Size from wholesalers

    2-Layer High Frequency PCB with 25mil Rogers RO3206 Substrate 0.75mm Thickness and 63mm x 45mm Size

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    Brand Name : Bicheng
    Model Number : BIC-052.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
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    2-Layer High Frequency PCB with 25mil Rogers RO3206 Substrate 0.75mm Thickness and 63mm x 45mm Size

    This high-performance printed circuit board (PCB) is meticulously engineered using Rogers' RO3206 high-frequency circuit material—a ceramic-filled laminate reinforced with woven fiberglass—to meet stringent electrical and mechanical standards, making it ideal for a wide range of high-frequency applications. Below is a comprehensive breakdown of its key specifications, construction details, and material attributes:


    PCB Construction Details

    ParameterDetails
    Base MaterialUtilizes Rogers' RO3206, renowned for exceptional electrical performance and mechanical stability
    Layer Count2-layer rigid PCB
    Board Dimensions63mm x 45mm per piece, with a tight tolerance of +/- 0.15mm
    Minimum Trace/Space4/4 mils, enabling the routing of fine signals critical for high-frequency operations.
    Minimum Hole Size0.3mm
    Finished Board Thickness0.75mm
    Finished Copper Weight1oz (1.4 mils) on outer layers, ensuring low resistance and efficient current carrying.
    Surface FinishImmersion Gold
    SilkscreenWhite silkscreen on the top layer for clear component labeling
    Solder MaskBlue solder mask on the top layer for protection against solder bridging
    Quality AssuranceUndergoes 100% electrical testing prior to shipment

    PCB Stack-up

    The 2-layer rigid PCB features a precise stack-up designed for optimal signal integrity:

    LayerSpecification
    Copper Layer 135 μm, providing a solid conductive path for signals.
    RO3206 Substrate0.635mm(25mil) thickness
    Copper Layer 235 μm, mirroring the top layer to maintain balanced electrical characteristics.

    Artwork and Standards

    Artwork Supplied: Gerber RS-274-X, the industry-standard format for PCB manufacturing data, ensuring compatibility with production processes.


    Accepted Standard: Manufactured to IPC-Class-2 specifications, ensuring high quality and reliability for general electronics applications.


    RO3206 Material Overview

    Rogers' RO3206 combines ceramic fillers with woven fiberglass reinforcement to deliver a balance of performance and affordability, making it a preferred choice for high-frequency designs. Its enhanced mechanical stability sets it apart within the RO3000 series.


    Key Features of RO3206

    Dielectric Constant: 6.15 with a tight tolerance of ±0.15 at 10 GHz/23°C, ensuring consistent signal propagation.


    Dissipation Factor: 0.0027 at 10 GHz, minimizing signal loss at high frequencies.


    Thermal Conductivity: 0.67 W/MK, efficient heat dissipation to prevent overheating.


    Moisture Absorption: Less than 0.1%, maintaining performance in humid environments.


    CTE Matching: Coefficient of thermal expansion (CTE) matched to copper (X-axis: 13 ppm/°C, Y-axis: 13 ppm/°C, Z-axis: 34 ppm/°C), reducing thermal stress during temperature fluctuations.


    Copper Peel Strength: 10.7 lbs/in, ensuring strong adhesion between copper layers and the substrate for long-term reliability.


    2-Layer High Frequency PCB with 25mil Rogers RO3206 Substrate 0.75mm Thickness and 63mm x 45mm Size


    Benefits of the PCB

    Woven Glass Reinforcement: Enhances rigidity, making the board easier to handle during assembly and reducing the risk of damage.


    Uniform Performance: Consistent electrical and mechanical properties across the board, ideal for complex high-frequency structures.


    Low Dielectric Loss: Enables superior high-frequency performance, critical for applications like wireless communications.


    Low In-Plane Expansion: CTE matched to copper supports compatibility with epoxy multilayer hybrid designs and ensures reliable surface-mounted assemblies.


    Dimensional Stability: Excellent stability leads to high production yields, reducing manufacturing costs.


    Cost-Effectiveness: Economically priced, suitable for volume manufacturing without compromising quality.


    Surface Smoothness: Allows for finer line etching tolerances, supporting the precise routing of small traces.


    Typical Applications

    This PCB is well-suited for a diverse range of applications, including:


    -Automotive collision avoidance systems and global positioning satellite antennas

    -Wireless telecommunications systems and microstrip patch antennas

    -Direct broadcast satellites and datalink on cable systems

    -Remote meter readers and power backplanes

    -LMDS (Local Multipoint Distribution Service) and wireless broadband infrastructure

    -Base station equipment for telecommunications networks


    Availability: This PCB is available for worldwide shipping, ensuring accessibility for global manufacturing and project needs.


    2-Layer High Frequency PCB with 25mil Rogers RO3206 Substrate 0.75mm Thickness and 63mm x 45mm Size

    Quality 2-Layer High Frequency PCB with 25mil Rogers RO3206 Substrate 0.75mm Thickness and 63mm x 45mm Size for sale
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