| Sign In | Join Free | My burrillandco.com |
|
We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
6 Years
| Ask Lasest Price | |
| Brand Name : | Bicheng |
| Model Number : | BIC-052.V1.0 |
| Certification : | UL, ISO9001, IATF16949 |
| Price : | USD9.99-99.99 |
| Payment Terms : | T/T |
| Supply Ability : | 5000PCS per month |
| Delivery Time : | 8-9 working days |
Rogers RO3035 ceramic-filled PTFE circuit materials are renowned for their outstanding properties, and this 2-layer rigid printed circuit board (PCB) capitalizes on these attributes to deliver high-performance results in high-frequency applications. Boasting optimized thickness, precise manufacturing parameters, and stable electrical performance across temperature fluctuations, it stands as the go-to choice for 5G, millimeter wave sub-6GHz, and massive MIMO systems.
1. PCB Specifications
| Parameter | Specification |
| Base Material | Rogers RO3035 (ceramic-filled PTFE-based high-frequency circuit material, part of the RO3000 series) |
| Layer Count | 2 layers (top and bottom outer copper layers) |
| Board Dimensions | 60mm × 30mm per unit (1PCS) |
| Minimum Trace/Space | 5 mils (trace width) / 7 mils (trace spacing) |
| Minimum Hole Size | 0.3mm; no blind vias supported |
| Finished Board Thickness | 0.37mm |
| Finished Copper Weight (Outer Layers) | 1oz (equivalent to 1.4 mils or 35μm) |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold (delivers excellent conductivity, corrosion resistance, and compatibility with surface-mount and wire-bonding processes) |
| Silkscreen | No |
| Solder Mask | No |
| Quality Assurance | 100% electrical testing conducted prior to shipment (eliminates open/short circuit defects and guarantees consistent operational reliability) |
2. PCB Stack-up Configuration
| Layer | Thickness |
| Top Copper Layer (Copper_layer_1) | 35μm |
| Rogers RO3035 Substrate | 10 mils (0.254mm) |
| Bottom Copper Layer (Copper_layer_2) | 35μm |
3. Quality Standards & Global Availability
This PCB adheres to industry-leading standards and is globally accessible, ensuring consistency, compatibility, and convenience for customers worldwide:
Artwork Format: Gerber RS-274-X
Accepted Quality Standard: IPC-Class-2
Availability: Global Accessibility
4. Rogers RO3035 Substrate: Introduction, Features & Benefits
4.1 Introduction to Rogers RO3035
Rogers RO3035 is a ceramic-filled, PTFE-based high-frequency circuit material designed to address the demands of modern wireless technologies. As part of the RO3000 series, it shares mechanical consistency with other RO3000 materials while offering a unique dielectric constant (Dk)—enabling engineers to develop multi-layer board designs without compromising on warping, reliability, or signal performance.
4.2 Key Features of Rogers RO3035
| Property | Value | Significance |
| Material Composition | Ceramic-filled PTFE composite | Balances ultra-low signal loss with excellent mechanical strength, ideal for high-frequency use |
| Dielectric Constant (Dk) | 3.5 ± 0.05 at 10 GHz / 23°C | Tight tolerance ensures predictable signal propagation, critical for 5G and millimeter wave design |
| Dissipation Factor | 0.0015 at 10 GHz / 23°C | Ultra-low signal loss, enabling reliable operation in applications up to 30–40 GHz |
| Decomposition Temperature (Td) | >500°C | Exceptional thermal resistance, suitable for high-power and high-temperature environments |
| Thermal Conductivity | 0.5 W/mK | Efficient heat dissipation, reducing component operating temperatures and extending lifespan |
| Moisture Absorption | 0.04% | Minimal water uptake, ensuring stable electrical performance in humid operating conditions |
| Coefficient of Thermal Expansion (CTE) | X-axis 17 ppm/°C, Y-axis 17 ppm/°C, Z-axis 24 ppm/°C (measured from -55°C to 288°C) | Low in-plane expansion matches copper, reducing thermal stress on solder joints and components |
4.3 Core Benefits of Rogers RO3035
These features translate to tangible advantages for both design engineers and end-users, addressing key challenges in high-frequency system development:
High-Frequency Compatibility: Supports applications up to 30–40 GHz, making it ideal for 5G millimeter wave, automotive radar, and satellite communications systems.
Enhanced Power Amplifier Performance: Reduces operating temperatures and improves reliability in power amplifiers—critical for high-power wireless infrastructure.
Uniform Mechanical Properties: Compatible with a range of dielectric constants, enabling flexible multi-layer board designs and hybrid assemblies with epoxy glass multi-layer boards (simplifying integration of high-frequency and low-frequency circuits).
Copper-Matched Thermal Expansion: Low in-plane CTE matches copper, ensuring reliable surface-mounted assemblies (SMAs), excellent dimensional stability, and resistance to thermal fatigue—even in temperature-sensitive applications like automotive radar.
Cost-Effective Volume Production: Supports high-volume manufacturing processes with economical laminate pricing, reducing total production costs while maintaining premium performance.
5. Some Typical Applications
- Automotive radar applications
- Global positioning satellite antennas
- Cellular telecommunications systems - power amplifiers and antennas
- Patch antenna for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes
To sum up, this two-layer Rogers RO3035 PCB is made with great precision and meets industry quality standards. It uses a high-performance base material, providing an affordable and reliable option for future high-frequency applications.
|
|
