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We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
6 Years
| Ask Lasest Price | |
| Brand Name : | Bicheng |
| Model Number : | BIC-332.V1.0 |
| Certification : | UL, ISO9001, IATF16949 |
| Price : | USD9.99-99.99 |
| Payment Terms : | T/T |
| Supply Ability : | 5000PCS per month |
| Delivery Time : | 8-9 working days |
This 2-layer RF PCB is constructed with Rogers TC600—a specialized composite of PTFE, thermally conductive ceramic fillers, and woven glass reinforcement. Engineered to deliver exceptional thermal conductivity (for heat management) and low dielectric loss (for signal integrity), it meets IPC-Class-2 standards and is ideal for power-dense, space-constrained applications like amplifiers, antennas, and avionics components.
PCB Specification
| Parameter | Details |
| Base Material | Rogers TC600 (PTFE + thermally conductive ceramic fillers + woven glass reinforcement) |
| Layer Count | Double sided (2-layer rigid PCB) |
| Board Dimensions | 112mm x 60mm (1 piece)±0.15mm |
| Minimum Trace/Space | 5/5 mils |
| Minimum Hole Size | 0.3mm |
| Via Type | No blind vias (thru-hole vias only) |
| Finished Board Thickness | 0.8mm |
| Finished Copper Weight (Outer Layers) | 1oz (1.4 mils total: 18μm base copper + 17μm plating per layer) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG) |
| Silkscreen | Top: White; Bottom: No |
| Solder Mask | Top: Green; Bottom: No |
| Quality Assurance | 100% Electrical test prior to shipment |
PCB Stack-up Details
| Layer Type | Material/Description | Thickness |
| Copper Layer (Top) | 18μm base copper + 17μm plating (finished: 1oz / 35μm total) | 35 μm (1oz) |
| Dielectric Layer | Rogers TC600 | 0.762 mm (30 mils) |
| Copper Layer (Bottom) | 18μm base copper + 17μm plating (finished: 1oz / 35μm total) | 35 μm (1oz) |
Material Overview: Rogers TC600 Laminates
Rogers TC600 is a advanced composite laminate designed to address two critical challenges in high-frequency and power-dense circuits: thermal management and signal loss. By combining PTFE (for low dielectric loss) with thermally conductive ceramic fillers (for heat transfer) and woven glass reinforcement (for mechanical robustness), TC600 delivers "best-in-class" thermal conductivity while minimizing dielectric and insertion loss. This unique formulation enables PCB size reduction (via higher efficiency), improves power handling, reduces hotspots, and enhances long-term device reliability—making it a top choice for avionics, antennas, and power amplifiers.
Key Material Features
| Specification | Value |
| Material Type | PTFE + thermally conductive ceramic fillers + woven glass reinforcement |
| Dielectric Constant (Dk) | 6.15 at 1.8 MHz and 10 GHz / 23°C |
| Dissipation Factor (tanδ) | 0.0017 at 1.8 GHz; 0.0020 at 10 GHz / 23°C |
| Thermal Conductivity | 1.1 W/mK |
| Temperature Coefficient of Dielectric Constant (TCDk) | -75 ppm/°C (range: -40°C to 140°C) |
| Coefficient of Thermal Expansion (CTE) | X-axis: 9 ppm/°C; Y-axis: 9 ppm/°C; Z-axis: 35 ppm/°C |
| Moisture Absorption | 0.03% |
Core Benefits
Enables Compact Design: Higher efficiency (from low loss) and thermal performance allow for smaller PCB footprints compared to lower-Dk substrates, ideal for space-constrained systems.
Superior Thermal Management: Best-in-class thermal conductivity (1.1 W/mK) reduces heat buildup, minimizes hotspots, and boosts power handling—extending component lifespan.
Low Signal Loss: Ultra-low dielectric loss (0.0017–0.0020) preserves signal integrity, leading to higher amplifier/antenna gains and efficiencies.
Stable Performance Across Temperatures: Consistent Dk (TCDk: -75 ppm/°C) and low CTE ensure reliability in extreme temperature ranges (-40°C to 140°C).
Reliable Component Integration: CTE closely matches active components, reducing stress on solder joints and improving long-term assembly reliability.
Easy Processing: Mechanical robustness (from woven glass reinforcement) simplifies manufacturing while maintaining dimensional stability.
Typical Applications
This PCB is optimized for high-power, high-frequency systems requiring thermal efficiency and signal integrity, including:
-Power Amplifiers, Filters, and Couplers
-Microwave Combiner and Power Divider Boards (Avionics Applications)
-Small Footprint Antennas
-Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)
-GPS & Hand-held RFID Reader Antennas
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