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6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

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    Buy cheap 6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias from wholesalers
     
    Buy cheap 6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias from wholesalers
    • Buy cheap 6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias from wholesalers

    6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

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    Brand Name : Bicheng
    Model Number : BIC-332.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

    This 6-layer hybrid PCB combines Rogers RO4350B (high-frequency laminate) and High Tg FR-4 (S1000-2M) to optimize performance for high-frequency, mission-critical applications.


    PCB Specification

    Construction ParameterSpecification
    Base MaterialRO4350B + High Tg FR-4 (S1000-2M)
    Layer Count6-layer
    Board Dimensions30.55mm x 37.7mm (1 piece) with tolerance of ±0.15mm
    Minimum Trace/Space4 mils / 4 mils
    Minimum Hole Size0.25mm
    Vias (Special Types)Blind vias (L1-L2)
    Finished Board Thickness1.3mm
    Finished Copper Weight (Inner/Outer Layers)1oz (1.4 mils)
    Via Plating Thickness20 μm
    Surface FinishElectroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
    Top SilkscreenWhite
    Bottom SilkscreenWhite
    Top Solder MaskNo
    Bottom Solder MaskGreen
    Quality Assurance (Electrical Testing)100% Electrical test performed prior to shipment

    Hybrid PCB Stack-up

    Layer SequenceLayer TypeSpecificationThickness
    1Copper Layer (Top)Copper_layer_135 μm
    2LaminateRO4350B0.102mm (4mil)
    3Copper LayerCopper_layer_235 μm
    4Prepreg1080 RC63% + 7628 (43%)0.254mm (10mil)
    5Copper LayerCopper_layer_335 μm
    6Core MaterialS1000-2M0.254mm (10mil)
    7Copper LayerCopper_layer_435 μm
    8Prepreg1080 RC63% + 7628 (43%)0.254mm (10mil)
    9Copper LayerCopper_layer_535 μm
    10Core MaterialS1000-2M0.254mm (10mil)
    11Copper Layer (Bottom)Copper_layer_635 μm

    What is a Hybrid PCB?

    A hybrid PCB (also known as a mixed-material PCB) is a specialized circuit board that integrates two or more distinct base materials in its stack-up, each selected to optimize specific performance attributes. Unlike single-material PCBs, which must compromise on certain properties, hybrid PCBs leverage the strengths of each material to address diverse design requirements.


    6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias


    Rogers RO4350B Material Overview

    Rogers RO4350B is a proprietary laminate composed of woven glass reinforcement blended with hydrocarbon/ceramic compounds, striking a balance between PTFE/woven glass-like electrical performance and the manufacturing simplicity of epoxy/glass materials.


    Tailored for high-frequency applications, RO4350B laminates offer tightly controlled dielectric constant (Dk) and maintain ultra-low signal loss—all while being processable using standard epoxy/glass manufacturing workflows. A cost-effective alternative to traditional microwave laminates, RO4350B eliminates the need for specialized through-hole treatments or handling procedures required by PTFE-based materials. It also holds a UL 94 V-0 flammability rating, making it suitable for active electronic devices and high-power RF designs.


    RO4350B Properties

    PropertySpecification
    Material TypeProprietary woven glass reinforced hydrocarbon/ceramic laminate
    Dielectric Constant (Dk)3.48 ±0.05 (measured at 10GHz/23°C)
    Dissipation Factor (Df)0.0037 (measured at 10GHz/23°C)
    Thermal Conductivity0.69 W/m/°K
    Coefficient of Thermal Expansion (CTE)X-axis: 10 ppm/°CY-axis: 12 ppm/°CZ-axis: 32 ppm/°C
    Glass Transition Temperature (Tg)>280°C (536°F)
    Moisture Absorption0.06% (max)
    Flammability RatingUL 94 V-0

    Core Features (S1000-2M High Tg FR-4)

    -Reduced Z-axis CTE, enhancing through-hole reliability in demanding environments


    -Superior mechanical processability paired with exceptional thermal resistance


    -Lead-free soldering compatibility, aligning with modern manufacturing standards


    -Glass Transition Temperature (Tg): 180°C (per DSC testing); UV-blocking properties for AOI compatibility


    -Outstanding high-heat endurance for stable performance in elevated temperature conditions


    -Excellent Anti-CAF (Conductive Anodic Filtration) performance, mitigating long-term reliability risks


    -Minimal moisture absorption, ensuring durability in humid operating environments


    Typical Applications

    -Commercial Airline Broadband Antennas

    -Microstrip and Stripline Circuits

    -Millimeter Wave Systems

    -Radar & Guidance Systems

    -Point-to-Point Digital Radio Antennas


    6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

    Quality 6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias for sale
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