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| Brand Name : | Bicheng |
| Model Number : | BIC-332.V1.0 |
| Certification : | UL, ISO9001, IATF16949 |
| Price : | USD9.99-99.99 |
| Payment Terms : | T/T |
| Supply Ability : | 5000PCS per month |
| Delivery Time : | 8-9 working days |
This high-performance 2-layer PCB is built with Rogers TMM4—a premium thermoset microwave material composed of ceramic, hydrocarbon, and thermoset polymer composite. Engineered for robust RF/microwave applications, it combines the mechanical resilience of ceramic with the process compatibility of traditional materials, eliminating the need for specialized fabrication techniques.
PCB Specification
| Parameter | Details |
| Base Material | Rogers TMM4 (ceramic-hydrocarbon thermoset polymer composite core) |
| Layer Count | 2-layer rigid PCB |
| Board Dimensions | 47mm x 118mm (1 piece)±0.15mm |
| Minimum Trace/Space | 5/7 mils |
| Minimum Hole Size | 0.35mm |
| Via Type | No blind vias (thru-hole vias only) |
| Finished Board Thickness | 1.6mm |
| Finished Copper Weight (Outer Layers) | 1oz (equivalent to 1.4 mils / 35 μm per layer) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Silver and Gold Plating (Gold over Silver) – ensures corrosion resistance, reliable soldering, and long-term contact performance |
| Silkscreen | Top: White; Bottom: No |
| Solder Mask | Top: Green; Bottom: No |
| Quality Assurance | 100% Electrical test prior to shipment |
PCB Stack-up Details
| Layer Type | Material/Description | Thickness |
| Copper Layer 1 (Outer) | Conductive copper (finished) | 35 μm (1oz) |
| Dielectric Core | Rogers TMM4 | 1.524 mm (60 mils) |
| Copper Layer 2 (Outer) | Conductive copper (finished) | 35 μm (1oz) |

Material Overview: Rogers TMM4
Rogers TMM4 is a specialized thermoset microwave laminate designed to bridge the gap between ceramic and PTFE materials—offering strong mechanical/chemical properties without requiring specialized production techniques. Its ceramic-hydrocarbon-thermoset polymer composition delivers exceptional reliability for stripline and microstrip applications, including wire-bonding (no pad lifting or substrate deformation) and plated through-holes. Unlike traditional PTFE laminates, TMM4’s thermoset resin base ensures compatibility with all common printed wiring board (PWB) processes, simplifying fabrication while maintaining high performance for RF/microwave circuits.
Key Material Features
| Specification | Value |
| Material Type | Ceramic-hydrocarbon thermoset polymer composite |
| Dielectric Constant (Dk) | 4.50 ± 0.045 |
| Dissipation Factor (tanδ) @ 10 GHz | 0.0020 |
| Thermal Coefficient of Dk (TCDk) | 15 ppm/°K |
| Coefficient of Thermal Expansion (CTE) | X-axis: 16 ppm/°K; Y-axis: 16 ppm/°K; Z-axis: 21 ppm/°K |
| Decomposition Temperature (Td, TGA) | 425 °C |
| Thermal Conductivity | 0.7 W/mK |
| Moisture Absorption | 0.07% – 0.18% |
| Available Thickness Range | 0.0015 – 0.500 inches (±0.0015 inches) |
| CTE Compatibility | Matched to copper |
Core Benefits
Superior Mechanical Stability: Resists creep and cold flow, ensuring long-term dimensional integrity even under stress (e.g., vibration in satellite systems).
Chemical Resistance: Withstands process chemicals used in PCB fabrication, reducing damage and improving yield rates.
Reliable Wire-Bonding: Thermoset resin base eliminates pad lifting or substrate deformation—critical for high-precision RF/microwave components.
High Plated Through-Hole Reliability: Ideal for multi-layer scalability, with consistent performance across production runs.
Standard Process Compatibility: Works with all common PWB manufacturing techniques, no specialized equipment required (lowers production complexity and cost).
Copper-Matched CTE: X/Y-axis CTE (16 ppm/°K) matches copper, minimizing thermal stress on solder joints and extending component lifespan.
Typical Applications
This PCB is optimized for high-performance RF/microwave systems requiring reliability and process flexibility, including:
-RF and Microwave Circuitry
-Power Amplifiers and Combiners
-Filters and Couplers
-Satellite Communication Systems
-Global Positioning Systems (GPS) Antennas
-Patch Antennas
-Dielectric Polarizers and Lenses
-Chip Testers

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