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Double-layer 1.6mm TMM4 PCB Silver and Gold Plating

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    Buy cheap Double-layer 1.6mm TMM4 PCB Silver and Gold Plating from wholesalers
     
    Buy cheap Double-layer 1.6mm TMM4 PCB Silver and Gold Plating from wholesalers
    • Buy cheap Double-layer 1.6mm TMM4 PCB Silver and Gold Plating from wholesalers

    Double-layer 1.6mm TMM4 PCB Silver and Gold Plating

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    Brand Name : Bicheng
    Model Number : BIC-332.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    Double-layer 1.6mm TMM4 PCB Silver and Gold Plating

    This high-performance 2-layer PCB is built with Rogers TMM4—a premium thermoset microwave material composed of ceramic, hydrocarbon, and thermoset polymer composite. Engineered for robust RF/microwave applications, it combines the mechanical resilience of ceramic with the process compatibility of traditional materials, eliminating the need for specialized fabrication techniques.


    PCB Specification

    ParameterDetails
    Base MaterialRogers TMM4 (ceramic-hydrocarbon thermoset polymer composite core)
    Layer Count2-layer rigid PCB
    Board Dimensions47mm x 118mm (1 piece)±0.15mm
    Minimum Trace/Space5/7 mils
    Minimum Hole Size0.35mm
    Via TypeNo blind vias (thru-hole vias only)
    Finished Board Thickness1.6mm
    Finished Copper Weight (Outer Layers)1oz (equivalent to 1.4 mils / 35 μm per layer)
    Via Plating Thickness20 μm
    Surface FinishSilver and Gold Plating (Gold over Silver) – ensures corrosion resistance, reliable soldering, and long-term contact performance
    SilkscreenTop: White; Bottom: No
    Solder MaskTop: Green; Bottom: No
    Quality Assurance100% Electrical test prior to shipment

    PCB Stack-up Details

    Layer TypeMaterial/DescriptionThickness
    Copper Layer 1 (Outer)Conductive copper (finished)35 μm (1oz)
    Dielectric CoreRogers TMM41.524 mm (60 mils)
    Copper Layer 2 (Outer)Conductive copper (finished)35 μm (1oz)

    Double-layer 1.6mm TMM4 PCB Silver and Gold Plating


    Material Overview: Rogers TMM4

    Rogers TMM4 is a specialized thermoset microwave laminate designed to bridge the gap between ceramic and PTFE materials—offering strong mechanical/chemical properties without requiring specialized production techniques. Its ceramic-hydrocarbon-thermoset polymer composition delivers exceptional reliability for stripline and microstrip applications, including wire-bonding (no pad lifting or substrate deformation) and plated through-holes. Unlike traditional PTFE laminates, TMM4’s thermoset resin base ensures compatibility with all common printed wiring board (PWB) processes, simplifying fabrication while maintaining high performance for RF/microwave circuits.


    Key Material Features

    SpecificationValue
    Material TypeCeramic-hydrocarbon thermoset polymer composite
    Dielectric Constant (Dk)4.50 ± 0.045
    Dissipation Factor (tanδ) @ 10 GHz0.0020
    Thermal Coefficient of Dk (TCDk)15 ppm/°K
    Coefficient of Thermal Expansion (CTE)X-axis: 16 ppm/°K; Y-axis: 16 ppm/°K; Z-axis: 21 ppm/°K
    Decomposition Temperature (Td, TGA)425 °C
    Thermal Conductivity0.7 W/mK
    Moisture Absorption0.07% – 0.18%
    Available Thickness Range0.0015 – 0.500 inches (±0.0015 inches)
    CTE CompatibilityMatched to copper

    Core Benefits

    Superior Mechanical Stability: Resists creep and cold flow, ensuring long-term dimensional integrity even under stress (e.g., vibration in satellite systems).


    Chemical Resistance: Withstands process chemicals used in PCB fabrication, reducing damage and improving yield rates.


    Reliable Wire-Bonding: Thermoset resin base eliminates pad lifting or substrate deformation—critical for high-precision RF/microwave components.


    High Plated Through-Hole Reliability: Ideal for multi-layer scalability, with consistent performance across production runs.


    Standard Process Compatibility: Works with all common PWB manufacturing techniques, no specialized equipment required (lowers production complexity and cost).


    Copper-Matched CTE: X/Y-axis CTE (16 ppm/°K) matches copper, minimizing thermal stress on solder joints and extending component lifespan.


    Typical Applications

    This PCB is optimized for high-performance RF/microwave systems requiring reliability and process flexibility, including:

    -RF and Microwave Circuitry

    -Power Amplifiers and Combiners

    -Filters and Couplers

    -Satellite Communication Systems

    -Global Positioning Systems (GPS) Antennas

    -Patch Antennas

    -Dielectric Polarizers and Lenses

    -Chip Testers


    Double-layer 1.6mm TMM4 PCB Silver and Gold Plating

    Quality Double-layer 1.6mm TMM4 PCB Silver and Gold Plating for sale
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