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F4BME233 PCB Substrate Copper Clad Laminate Sheet

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    Buy cheap F4BME233 PCB Substrate Copper Clad Laminate Sheet from wholesalers
     
    Buy cheap F4BME233 PCB Substrate Copper Clad Laminate Sheet from wholesalers
    • Buy cheap F4BME233 PCB Substrate Copper Clad Laminate Sheet from wholesalers

    F4BME233 PCB Substrate Copper Clad Laminate Sheet

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    Brand Name : Bicheng
    Model Number : BIC-332.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
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    F4BME233 PCB Substrate Copper Clad Laminate Sheet

    F4BME233 is a composite material produced via a carefully engineered formulation and precise manufacturing process, using fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. Compared to standard F4B laminates, it exhibits improved electrical properties, including a broader dielectric constant range, lower dielectric loss, higher insulation resistance, and greater overall stability. This makes it a suitable alternative to similar international products.


    This material is supplied with reverse-treated RTF copper foil, delivering excellent passive intermodulation (PIM) performance, superior etching control for precision circuitry, and reduced conductor loss.


    The dielectric constant of F4BME233 is accurately controlled by adjusting the ratio of PTFE to fiberglass reinforcement. This balance ensures both low signal loss and enhanced dimensional stability. Higher dielectric constant variants incorporate a greater fiberglass content, resulting in improved dimensional stability, lower thermal expansion, better temperature-dependent performance, and a corresponding increase in dielectric loss.


    F4BME233 PCB Substrate Copper Clad Laminate Sheet


    Product Features

    • Dielectric constant (Dk) range: 2.33
    • Low loss performance
    • Excellent PIM characteristics with RTF foil
    • Multiple size options for material optimization and cost savings
    • Resistant to radiation with low outgassing properties
    • Commercially available in volume at a competitive price

    Typical Applications

    • Microwave, radio frequency, and radar systems
    • Phase shifters and passive components
    • Power dividers, couplers, and combiners
    • Feed networks and phased array antennas
    • Satellite communications and base station antennas

    Product Technical ParametersProduct Model & Data Sheet
    Product FeaturesTest ConditionsUnitF4BME233
    Dielectric Constant (Typical)10GHz/2.33
    Dielectric Constant Tolerance//±0.04
    Loss Tangent (Typical)10GHz/0.0011
    20GHz/0.0015
    Dielectric Constant Temperature Coefficient-55ºC~150ºCPPM/℃-130
    Peel Strength1 OZ F4BMN/mm>1.8
    1 OZ F4BMEN/mm>1.6
    Volume ResistivityStandard ConditionMΩ.cm≥6×10^6
    Surface ResistivityStandard Condition≥1×10^6
    Electrical Strength (Z direction)5KW,500V/sKV/mm>23
    Breakdown Voltage (XY direction)5KW,500V/sKV>32
    Coefficientof Thermal ExpansionXY direction-55 º~288ºCppm/ºC22, 30
    Z direction-55 º~288ºCppm/ºC205
    Thermal Stress260℃, 10s,3 timesNo delamination
    Water Absorption20±2℃, 24 hours%≤0.08
    DensityRoom Temperatureg/cm32.20
    Long-Term Operating TemperatureHigh-Low Temperature Chamber-55~+260
    Thermal ConductivityZ directionW/(M.K)0.28
    PIMOnly applicable to F4BMEdBc≤-159
    Flammability/UL-94V-0
    Material Composition//PTFE, Fiberglass Cloth
    F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

    F4BME233 PCB Substrate Copper Clad Laminate Sheet

    Quality F4BME233 PCB Substrate Copper Clad Laminate Sheet for sale
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