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We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
6 Years
| Ask Lasest Price | |
| Brand Name : | Bicheng |
| Model Number : | BIC-332.V1.0 |
| Certification : | UL, ISO9001, IATF16949 |
| Price : | USD9.99-99.99 |
| Payment Terms : | T/T |
| Supply Ability : | 5000PCS per month |
| Delivery Time : | 8-9 working days |
F4BME220 is manufactured through precise processes using fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. It exhibits superior electrical properties compared to standard F4B, including a broader dielectric constant range, lower dielectric loss, higher insulation resistance, and enhanced stability, making it a viable alternative to comparable international products.
The dielectric layers of F4BM220 and F4BME220 are identical, but they employ different copper foils: F4BM220 uses ED copper foil and is intended for applications where PIM is not specified; F4BME220 utilizes reverse-treated RTF copper foil, delivering excellent PIM performance, more accurate circuit control, and reduced conductor loss.
Both F4BM220 and F4BME220 allow precise adjustment of the dielectric constant by modifying the ratio of PTFE to fiberglass cloth. This optimization achieves low signal loss while improving dimensional stability. A higher dielectric constant corresponds to a greater fiberglass content, resulting in better dimensional stability, a lower coefficient of thermal expansion, improved temperature drift characteristics, and a moderate increase in dielectric loss.
Product Features:
Typical Applications:
| Product Technical Parameters | Product Model & Data Sheet | |||
| Product Features | Test Conditions | Unit | F4BME220 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.2 | |
| Dielectric Constant Tolerance | / | / | ±0.04 | |
| Loss Tangent (Typical) | 10GHz | / | 0.001 | |
| 20GHz | / | 0.0014 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -142 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >23 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >30 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 25, 34 |
| Z direction | -55 º~288ºC | ppm/ºC | 240 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.18 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.24 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | |
| Flammability | / | UL-94 | V-0 | |
| Material Composition | / | / | ||
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