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AD250C PCB Material High Frequency Laminates Copper Clad Sheet

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    Buy cheap AD250C PCB Material High Frequency Laminates Copper Clad Sheet from wholesalers
     
    Buy cheap AD250C PCB Material High Frequency Laminates Copper Clad Sheet from wholesalers
    • Buy cheap AD250C PCB Material High Frequency Laminates Copper Clad Sheet from wholesalers

    AD250C PCB Material High Frequency Laminates Copper Clad Sheet

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    Brand Name : Bicheng
    Model Number : BIC-332.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    AD250C PCB Material High Frequency Laminates Copper Clad Sheet

    AD250C is a glass-reinforced, PTFE-based composite engineered to deliver a stable dielectric constant, low signal loss, and excellent passive intermodulation (PIM) performance. The woven glass construction enhances circuit processability and supports high-yield PCB fabrication.


    AD250C meets the diverse requirements of modern antenna designs. This versatility, combined with precise dielectric control, ensures consistent impedance performance across production runs.


    The material is offered with standard electrodeposited (ED) copper or reverse-treated ED copper foil, allowing designers to optimize for reduced circuit loss and improved PIM performance.


    As a PTFE-based composite, AD250C exhibits exceptionally low loss—typically below 0.002 at 10 GHz—along with minimal moisture absorption (<0.1%) and high copper peel strength (>10 pli). These characteristics make AD250C laminates a reliable, high-performance solution for antenna applications.


    AD250C PCB Material High Frequency Laminates Copper Clad Sheet


    Features and Benefits

    • Low loss tangent (<0.002 at 10 GHz) – Delivers excellent circuit performance across all common wireless frequency bands
    • Controlled dielectric constant (±0.05) – Ensures repeatable and reliable circuit performance
    • Very low PIM (-159 dBc at 30 mil, 1900 MHz) – Enhances antenna performance and minimizes yield loss due to PIM issues
    • Excellent dimensional stability – Supports consistent circuit performance and improved manufacturing yields

    Typical Applications

    • Cellular infrastructure base station antennas
    • Automotive telematics antenna systems
    • Commercial satellite radio antennas

    PropertiesAD250CUnitsTest ConditionsTest Frequency / DetailsTest Method
    Electrical Properties
    Dielectric Constant (process)2.52-23°C @ 50% RH10 GHzIPC TM-650 2.5.5.5
    Dielectric Constant (design)2.50-C-24/23/5010 GHz, Microstrip Differential Phase Length-
    Dissipation Factor0.0013-23°C @ 50% RH10 GHzIPC TM-650 2.5.5.5
    Thermal Coefficient of Dielectric Constant-117ppm/°C0 to 100°C10 GHzIPC TM-650 2.5.5.5
    Volume Resistivity4.8 × 10⁸MΩ·cmC96/35/90-IPC TM-650 2.5.17.1
    Surface Resistivity4.1 × 10⁷C96/35/90-IPC TM-650 2.5.17.1
    Electrical Strength (dielectric strength)979V/mil--IPC TM-650 2.5.6.2
    Dielectric Breakdown>40kVD-48/50X/Y directionIPC TM-650 2.5.6
    PIM-159/-163dBcReflected 43 dBm swept tones at 1900 MHz S1/S150 ohmRogers Internal
    Thermal Properties
    Decomposition Temperature (Td)>500°C2 hrs @ 105°C5% Weight LossIPC TM-650 2.3.40
    CTE x47ppm/°C-55°C to 288°C-IPC TM-650 2.4.41
    CTE y29ppm/°C-55°C to 288°C-IPC TM-650 2.4.41
    CTE z196ppm/°C-55°C to 288°C-IPC TM-650 2.4.41
    Thermal Conductivity0.33W/(m·K)-z directionASTM D5470
    Time to Delamination>60minutesas-received288°CIPC TM-650 2.4.24.1
    Mechanical Properties
    Copper Peel Strength2.6 (14.8)N/mm (lbs/in)10 s @288°C35 μm foilIPC TM-650 2.4.8
    Flexural Strength (MD/CMD)60.7/44.1 (8.8/6.4)MPa (ksi)25°C ± 3°C-ASTM D790
    Tensile Strength (MD, CMD)41.4/38.6 (6.0/5.6)MPa (ksi)23°C @ 50% RH-ASTM D3039/D3039-14
    Flex Modulus6102/5364 (885/778)MPa (ksi)25°C ± 3°C-IPC-TM-650 2.4.4
    Dimensional Stability (MD, CMD)0.02/0.06mils/inchafter etch + bake-IPC-TM-650 2.4.39a
    Physical Properties
    FlammabilityV-0---UL 94
    Moisture Absorption0.04%E1/105 + D48/50-IPC TM-650 2.6.2.1
    Density2.28g/cm³C24/23/50-ASTM D792
    Specific Heat Capacity0.813J/g·K2 hours at 105°C-ASTM E2716
    Quality AD250C PCB Material High Frequency Laminates Copper Clad Sheet for sale
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