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4-layer High-Frequency Hybrid PCB on RT duroid 5880 and FR-4

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    Buy cheap 4-layer High-Frequency Hybrid PCB on RT duroid 5880 and FR-4 from wholesalers
     
    Buy cheap 4-layer High-Frequency Hybrid PCB on RT duroid 5880 and FR-4 from wholesalers
    • Buy cheap 4-layer High-Frequency Hybrid PCB on RT duroid 5880 and FR-4 from wholesalers

    4-layer High-Frequency Hybrid PCB on RT duroid 5880 and FR-4

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    Brand Name : Bicheng
    Model Number : BIC-332.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    4-layer High-Frequency Hybrid PCB on RT duroid 5880 and FR-4

    This 4-layer high-frequency hybrid PCB adopts a composite substrate combining RT/duroid 5880 and high Tg FR4, which perfectly balances excellent high-frequency performance and cost-effectiveness. Manufactured in strict compliance with IPC-3 standards, it features precise structural control and reliable process quality, equipped with controlled depth slot technology and high-standard copper plating, making it suitable for high-frequency signal transmission scenarios that require stability and precision.


    PCB Specifications

    Specification ItemTechnical Specification
    Layer Configuration4-Layer Rigid PCB (6-layer structure)
    Base Substrate MaterialRT/duroid 5880 + High Tg FR4 (Hybrid Substrate)
    Finished Board Thickness1.0 mm
    Board Dimensions90mm × 80mm (per unit), 1 piece per unit
    Copper Weight (Inner Layers)0.5 oz
    Finished Copper Weight1 oz
    Surface FinishImmersion Gold (2 U")
    Solder Mask & SilkscreenBlue Solder Mask with White Silkscreen Text
    Plated Through-Hole (PTH) Copper Thickness25 μm
    Quality StandardIPC-3 Compliant
    Special ProcessControlled Depth Slot (Depth tolerance is strictly maintained within ±0.05mm with real-time laser ranging feedback; slot wall angle is 85°-90° achieved via mechanical milling).


    PCB Stack-Up Structure (From Top to Bottom)

    Layer/ComponentThickness
    L1 Copper (Top Layer)0.035 mm
    RT/duroid 5880 Core0.254 mm
    L2 Copper (Inner Layer 1)0.018 mm (0.5 oz)
    Prepreg0.12 mm
    FR4 Core0.1 mm
    Prepreg0.12 mm
    L3 Copper (Inner Layer 2)0.018 mm (0.5 oz)
    FR4 Core0.254 mm
    L4 Copper (Bottom Layer)0.035 mm


    4-layer High-Frequency Hybrid PCB on RT duroid 5880 and FR-4


    RT/duroid 5880 Substrate Introduction

    RT/duroid 5880 is a glass microfiber reinforced PTFE composite material, specifically designed for exacting stripline and microstrip circuit applications. Its randomly oriented microfibers ensure exceptional dielectric constant uniformity, which is consistent from panel to panel and remains stable over a wide frequency range. With a low dissipation factor, it can be applied to Ku-band and above. The material is easy to cut, shear and machine, and resistant to all solvents and reagents (hot or cold) commonly used in PCB etching and plating processes. It is an ideal high-frequency substrate for scenarios requiring stable electrical performance.


    Key Features

    -Lowest electrical loss among reinforced PTFE materials


    -Low moisture absorption, ensuring stable performance in different environments


    -Isotropic, with uniform physical and electrical properties in all directions


    -Uniform electrical properties over a wide frequency range


    -Excellent chemical resistance, compatible with common PCB processing reagents


    Application Fields

    • Commercial Airline Broadband Antennas
    • Microstrip and Stripline Circuits
    • Millimeter Wave Applications
    • Radar Systems
    • Missile Guidance Systems
    • Point to Point Digital Radio Antennas


    Processing Points

    Surface Treatment: After etching, protect the dielectric surface roughness to enhance inner layer bonding; pure PTFE surface requires sodium treatment or plasma treatment to improve adhesion.


    Cleaning & Drying: Ensure the board surface is clean and dry before milling; avoid mechanical brushing to prevent surface damage.


    Copper Surface Treatment: Select appropriate inner copper surface treatment (such as oxidation) according to the prepreg type, following PTFE multi-layer board processing guidelines.


    Machinability: Easy to cut, shear and machine, compatible with standard PCB processing equipment, but needs to control processing parameters to ensure dimensional stability.


    Controlled Depth Slot Introduction

    Definition

    Controlled depth slot is a special PCB processing technology that involves milling a slot with a specific depth on the board surface, without penetrating the entire board thickness. It is mainly used to meet the assembly requirements of components, avoid signal interference, or realize special structural design, ensuring the PCB can be perfectly matched with other components in the electronic device.


    Processing Requirements

    Depth Tolerance: Strictly controlled within ±0.05mm, with real-time laser ranging feedback to ensure precision.


    Slot Wall Angle: Maintained at 85°-90° through mechanical milling, ensuring the slot wall is flat and smooth, meeting assembly and signal transmission requirements.


    Processing Precision: High precision milling equipment is required to avoid slot edge burring, uneven depth, and other defects that affect product performance.


    Application Significance

    The controlled depth slot technology effectively solves the problem of component assembly interference and signal crosstalk in high-frequency PCBs. It ensures the compact structure of the PCB, improves the integration of the device, and at the same time maintains the structural strength of the board, ensuring the stability and reliability of the product in long-term operation.


    4-layer High-Frequency Hybrid PCB on RT duroid 5880 and FR-4

    Quality 4-layer High-Frequency Hybrid PCB on RT duroid 5880 and FR-4 for sale
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