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24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance

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24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance

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Brand Name :	Bicheng
Model Number :	BIC-483.V1.0
Certification :	UL, ISO9001, IATF16949
Price :	USD9.99-99.99
Payment Terms :	T/T
Supply Ability :	5000PCS per month
Delivery Time :	8-9 working days

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24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance

Multilayer PCB 24 Layer Printed Circuit Board Built On High Temperature FR-4 With 50 Ohm / 100 Ohm Impedance for Industrial controls

General description

This is a type of high multilayer PCB built on FR-4 substrate with Tg 170°C for the application of Industrial controls with 24 layer copper track. It's 3.7 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and immersion gold on pads. This is also an impedance controlled PCB with single-end impedance of 50 ohm and differential impedance of 100 ohm. The base material is from ITEQ supplying single up PCB. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 panels are packed for shipment.

Features and benifits

Excellent thermal reliability and CAF resistance providing long-term reliability for industrial and automobile application.

Long storage time ( It can be stored for more than 1 year in vacuum bag)

The signal lines form a constant low impedance to the ground

Micro-section and thermal stress test

16000 square meter workshop

Small quantity order is accepted

ISO9001, ISO14001, IATF16949, UL Certified

We can find its Applications in transmitter, GSM Modem, 3G WiFi Router, phase Shifter, embedded Controller, hard drives.

24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance

Printed Circuit Board Capability 2020

Parameter	Value
Layer Counts	1-32
Substrate Material	FR-4(including High Tg 170, High CTI>600V); Aluminum based; Copper based; Rogers RO4350B, RO4003C, RO3003, RO3006, RO3010, RO3210 etc.; Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010 etc..; Taconic TLX-8, TLY-5, RF-35TC, TLF-35 etc..; Arlon AD450, AD600 etc; PTFE F4B DK2.2, DK2.65 etc..; Polyimide and PET.
Maximum Size	Flying test: 900600mm, Fixture test 460380mm, No test 1100*600mm
Board Outline Tolerance	±0.0059" (0.15mm)
PCB Thickness	0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)	±8%
Thickness Tolerance(t＜0.8mm)	±10%
Insulation Layer Thickness	0.00295" - 0.1969" (0.075mm--5.00mm)
Minimum Track	0.003" (0.075mm)
Minimum Space	0.003" (0.075mm)
Outer Copper Thickness	35µm--420µm (1oz-12oz)
Inner Copper Thickness	17µm--420µm (0.5oz - 12oz)
Drill Hole(Mechanical)	0.0059" - 0.25" (0.15mm--6.35mm)
Finished Hole(Mechanical)	0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical)	0.00295" (0.075mm)
Registration (Mechanical)	0.00197" (0.05mm)
Aspect Ratio	12:1
Solder Mask Type	LPI
Min Soldermask Bridge	0.00315" (0.08mm)
Min Soldermask Clearance	0.00197" (0.05mm)
Plug via Diameter	0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance	±10%
Surface Finish	HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

Parameter and data sheet

PCB SIZE	400 x 212mm=1PCS
BOARD TYPE	Multilayer PCB
Number of Layers	24 Layers
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	TOP LAYER 0.018mm+plating Layer 1
	Prepreg 0.1016mm
	PLANE 1 --- 0.035mm Layer 2
	CORE FR4 0.1016mm
	GROUND 1 --- 0.035mm Layer 3
	Prepreg 0.127mm
	SIGNAL 1 --- 0.018mm
	CORE FR4 0.1524mm
	PLANE 2 --- 0.035mm
	Prepreg 0.1016mm
	GROUND 2 --- 0.035mm
	CORE FR4 0.127mm
	SIGNAL 2 --- 0.018mm
	Prepreg 0.1524mm
	PLANE 3 --- 0.035mm
	CORE FR4 0.1016mm
	PLANE,GROUND 7 --- 0.035mm
	Prepreg 0.127mm
	SIGNAL 3 --- 0.018mm
	CORE FR-4 0.1524mm
	GROUND 3 --- 0.035mm
	Prepreg 0.127mm
	SIGNAL 4 --- 0.018mm
	CORE FR4 0.1524mm
	PLANE 4 --- 0.035mm
	Prepreg 0.1016mm
	GROUND 4 --- 0.035mm
	CORE FR4 0.1016mm
	SIGNAL 5 --- 0.018mm
	Prepreg 0.1524mm
	SIGNAL 6 --- 0.018mm
	CORE FR4 0.1016mm
	PLANE 5 --- 0.035mm
	Prepreg 0.1016mm
	GROUND 5 --- 0.035mm
	CORE FR4 0.1524mm
	SIGNAL 7 --- 0.018mm
	Prepreg 0.127mm
	PLANE 6 --- 0.035mm
	CORE FR4 0.1524mm
	SIGNAL 8 --- 0.018mm
	Prepreg 0.127mm
	POWER, RROUND 8 --- 0.035mm Layer 22
	CORE FR4 0.1016mm
	GROUND 6 --- 0.035mm Layer 23
	Prepreg 0.1016mm
	BOTTOM LAYER --- 0.018mm + plating Layer 24
TECHNOLOGY
Minimum Trace and Space:	5 mil / 5 mil
Minimum / Maximum Holes:	0.36 /3.2mm
Number of Different Holes:	9
Number of Drill Holes:	9117
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	Yes, all of signal layers of 8 copper layers, 50 OHM Impedance Controlled for single ended on 5 mil track & 100 OHM for Differential routes on 5mil / 8 mil
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	FR-4 Tg170℃, er<5.4.IT-180, ITEQ Supplied
Final foil external:	1oz
Final foil internal:	1oz
Final height of PCB:	3.7mm ±0.10%
PLATING AND COATING
Surface Finish	Immersion gold (29.1% ) 0.05µm over 3µm nickel
Solder Mask Apply To:	TOP and Bottom, 12micron Minimum
Solder Mask Color:	Green, PSR-2000 KX700G, Taiyo Supplied.
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP and Bottom.
Colour of Component Legend	White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Via hole filling at BGA required.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

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