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High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold

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    Buy cheap High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold from wholesalers
     
    Buy cheap High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold from wholesalers
    • Buy cheap High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold from wholesalers
    • Buy cheap High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold from wholesalers
    • Buy cheap High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold from wholesalers
    • Buy cheap High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold from wholesalers
    • Buy cheap High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold from wholesalers

    High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold

    Ask Lasest Price
    Brand Name : Bicheng
    Model Number : BIC-480.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
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    High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold

    High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170 With Immersion Gold


    1.1 General description

    This is a type of 14-layer HDI printed circuit board built on FR-4 Tg170 substrate for the application of codec equipment. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. The PCBs contains 2+N+2 high density interconnection layers, microvias on different layers are stacked. The base material is from ITEQ supplying in 1 up board per panel.They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panels are packed for shipment.


    1.2 Our Advantages

    ISO9001, ISO14001, IATF16949, UL Certified;

    Prototype to volume Production Capability;

    16000㎡ workshop;

    30000㎡ output capability per month;

    8000 types of PCB's per month;

    IPC Class 2 / IPC Class 3;

    Eligible products rate of first production: >95%


    1.3 Applications of HDI PCBs

    Oscilloscope
    Wireless Booster
    Access Point WiFi
    4G WiFi
    GSM Router
    Card Access Systems
    Instrumentation


    High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold


    1.4 Parameter and data sheet

    Number of Layers14-Layer
    Board TypeMultilayer PCB
    Board size220mm x 170mm=4PCS
    Board Thickness2.0 mm +/-0.16
    Board MaterialFR-4
    Board Material SupplierITEQ
    Tg Value of Board Material170℃
    PTH Cu thickness≥20 um
    Inner Iayer Cu thicknes18 um (0.5oz)
    Surface Cu thickness35 um (1oz)
    Solder Mask Type and Model No.LPSM, PSR-2000GT600D
    Solder Mask SupplierTAIYO
    Solder Mask ColourGreen
    Number of Solder Masks2
    Thickness of Solder Mask14 um
    Type of Silkscreen InkIJR-4000 MW300
    Supplier of SilkscreenTAIYO
    Color of SilkscreenWhite
    Number of Silkscreen1
    Mininum Trace (mil)5.8 mil
    Minimum Gap(mil)6.2 mil
    Surface FinishImmersion Gold
    RoHS RequiredYes
    Warpage0.25%
    Thermal Shock TestPass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering.
    Solderablity TestPass, 255±5℃,5 seconds Wetting Area Least 95%
    Function100% Pass electrical test
    WorkmanshipCompliance with IPC-A-600H & IPC-6012C Class 2
    Drill Table (mm)
    T10.300
    T20.450
    T30.580
    T40.590
    T50.690
    T60.650
    T71.000
    T81.150
    T91.200
    T101.300
    T111.400
    T121.500
    T131.600
    T141.700
    T152.050
    T162.550
    T173.000
    T183.200
    T193.450

    High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold


    1.5 Different Types of HDI PCBs

    To simplify the high density interconnect PCB, we define 3 types of HDI PCBs as below:

    1+N+1, PCBs contain 1-time laser drill and pressing in the HDI boards.

    I+N+I (I≥2), PCBs contain 2-time laser drill and pressing or more times laser drill and pressing, including the microvias staggered or stacked on different layers.

    Any layer HDI, blind vias and buried vias can be freely put on different layers as designer want.


    High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold


    Quality High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold for sale
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