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20mil RT Duroid 6035HTC PCB Substrates 1oz With Immersion Silver

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    Buy cheap 20mil RT Duroid 6035HTC PCB Substrates 1oz With Immersion Silver from wholesalers
     
    Buy cheap 20mil RT Duroid 6035HTC PCB Substrates 1oz With Immersion Silver from wholesalers
    • Buy cheap 20mil RT Duroid 6035HTC PCB Substrates 1oz With Immersion Silver from wholesalers
    • Buy cheap 20mil RT Duroid 6035HTC PCB Substrates 1oz With Immersion Silver from wholesalers

    20mil RT Duroid 6035HTC PCB Substrates 1oz With Immersion Silver

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    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    20mil RT Duroid 6035HTC PCB Substrates 1oz With Immersion Silver

    Introducing our newly shipped PCB, crafted with Rogers RT/duroid 6035HTC material, a cutting-edge substrate designed to deliver exceptional performance for your electronic designs. With its advanced features and reliable construction, this PCB unlocks new possibilities for a wide range of applications. Let's delve into the key specifications and benefits that make this PCB a game-changer for your projects.


    PCB Substrates: Unparalleled Performance and Thermal Stability

    The Rogers RT/duroid 6035HTC material is a ceramic-filled PTFE composite, known for its outstanding performance and thermal stability. With a dielectric constant (DK) of 3.5 +/- 0.05 at 10 GHz/23°C, this substrate provides excellent electrical efficiency, making it ideal for high-frequency applications. The low dissipation factor of 0.0013 at 10 GHz/23°C guarantees minimal signal loss, ensuring optimal signal integrity.


    Dielectric Constant,εProcess3.50±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.6Z8 GHz - 40 GHzDifferential Phase Length Method
    Dissipation Factor0.0013Z10 GHz/23IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε-66Zppm/℃-50 to 150mod IPC-TM-650, 2.5.5.5
    Volume Resistivity108MΩ.cmAIPC-TM-650, 2.5.17.1
    Surface Resistivity108AIPC-TM-650, 2.5.17.1
    Dimensional Stability-0.11 -0.08CMD MDmm/m (mils/inch)0.030" 1oz EDC foil Thickness after etch '+E4/105IPC-TM-650 2.4.39A
    Tensile Modulus329 244MD CMDkpsi40 hrs @23/50RHASTM D638
    Moisure Absorption0.06%D24/23IPC-TM-650 2.6.2.1 ASTM D570
    Coefficient of Thermal Expansion (-50 to 288 )19 19 39X Y Zppm/23 / 50% RHIPC-TM-650 2.4.41
    Thermal Conductivity1.44W/m/k80ASTM C518
    Density2.2gm/cm323ASTM D792
    Copper Peel Stength7.9pli20 sec. @288 IPC-TM-650 2.4.8
    FlammabilityV-0UL 94
    Lead-Free Process CompatibleYes

    Thermal Management and Stability: Key Features for High-Power Applications

    This PCB excels in thermal management with its high thermal conductivity of 1.44 W/m/K at 80°C. It efficiently dissipates heat, allowing for lower operating temperatures in high-power applications. The low loss tangent ensures excellent high-frequency performance, enabling your circuits to operate seamlessly. The thermally stable low-profile and reverse-treated copper foil contribute to lower insertion loss and excellent thermal stability of traces. The advanced filler system enhances drillability and extends tool life compared to alumina-containing circuit materials.


    Precise Construction Details for Optimal Performance

    The construction of this PCB features a 2-layer rigid design. It consists of copper layers with a thickness of 35 μm, enclosing the 0.508 mm (20mil) RT/duroid 6035HTC core. The board dimensions measure 150.2 mm x 66.5 mm, offering ample space for your designs. With a tolerance of +/- 0.15mm, precise manufacturing is ensured. The PCB supports a minimum trace/space of 7/7 mils and a minimum hole size of 0.5mm, accommodating intricate circuit layouts. The finished board thickness is 0.6mm, with 1oz (1.4 mils) outer layer copper weight and 20 μm via plating thickness, ensuring robust construction and reliable performance.

    PCB Material:Ceramic-filled PTFE composites
    Designation:RT/duroid 6035HTC
    Dielectric constant:3.50±0.05
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP etc..

    Additional Specifications and Applications

    This PCB boasts an immersion silver surface finish, providing excellent conductivity and corrosion resistance. It does not include silkscreen or solder mask, offering a clean and minimalistic appearance. Before shipment, the PCB undergoes 100% electrical testing to ensure the highest quality standards for your projects.


    20mil RT Duroid 6035HTC PCB Substrates 1oz With Immersion Silver


    With worldwide availability, this PCB suits various industries and applications. Its exceptional performance makes it an ideal choice for high-frequency and high-power applications, such as RF and microwave amplifiers, power amplifiers, couplers, filters, and more. Embrace the future of advanced PCB technology with Rogers RT/duroid 6035HTC and elevate your designs to unprecedented levels of performance and reliability.


    For any technical inquiries or to explore the possibilities of RT/duroid 6035HTC in your applications, please contact our dedicated sales team at sales10@bichengpcb.com. Experience the power of advanced PCB materials and take your projects to new heights of success.

    Quality 20mil RT Duroid 6035HTC PCB Substrates 1oz With Immersion Silver for sale
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